History of Neocera Magma

Office front shot of Neocera

Neocera’s Development of Magnetic Field Microscopy

Neocera Magma was established in 1997 using SQUID technology to image magnetic fields in electronic devices. Neocera has since added several key patented innovations and introduced its Magma product line to the semiconductor industry, enabling the detection of shorts, opens, and leakages within a given package. A giant magnetoresistive (GMR) sensor was added to the Magma product line to enable high-resolution defect localization on the die of semiconductor chips. Neocera Magma innovations continued to enhance the fault isolation capability of magnetic field imaging, providing improved signal-to-noise ratios. As a result, Magma magnetic field microscopes are uniquely capable of localizing all static electrical faults. The permeation of the magnetic field through all materials used in semiconductor device fabrication makes this the preferred technique for localizing buried defects.

Publications

Orozco, A. (2019). Magnetic Field Imaging for Electrical Fault Isolation. Microelectronics Failure Analysis Desk Reference, 111.

Orozco, A., Talanova, E., Jeffers, A., Rusli, F., Zee, B., Qiu, W., … & Mora, J. A. (2018, December). Non-Destructive 3D Failure Analysis Work Flow for Electrical Failure Analysis in Complex 2.5 D-Based Devices Combining 3D Magnetic Field Imaging and 3D X-Ray Microscopy. In ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis (p. 32). ASM International.

Kaneko & A. Orozco (2017). Current Imaging using SQUID and GMR Sensors for Failure Analysis. In Proceedings of the 37th Annual NANO Testing Symposium  (NANOTS2017). Osaka: Institute of NANO Testing.

Alex Jeffers, Antonio Orozco, Nicolas Gagliolo, F C. Wellstood, & A. B. Cawthorne (2016). 3D Fault Isolation on FBI Modified Multilayer Structure Device Using 3D Magnetic Field Imaging. In Proceedings of the 36th Annual NANO Testing Symposium  (NANOTS2016).

Orozco, A., Rusli, F., Rowlett, C., Zee, B., Qiu, W., Chin, J. M., & Foo, F. J. (2016). 3D Fault Isolation in 2.5D Device comprising High Bandwidth Memory (HBM) Stacks and Processor Unit Using 3D Magnetic Field Imaging. In Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis (pp. 426-432).

Gaudestad, J., Orozco, A., & Chen, J. (2015, April). Short localization in CPU FlipChip using thermal imaging and magnetic current imaging: Advanced fault isolation technique comparison. In 2015 IEEE International Reliability Physics Symposium (pp. FA-3). IEEE.

Gaudestad, J., Orozco, A., Matthews, J., Huang, P. C., & Chen, Y. H. J. (2015, June). Magnetic Current Imaging using multi-path analysis for power short localization. In 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 556-559). IEEE.

Vallett, D. (2014). Magnetic current imaging revisited. ASM Int, 4, 26-34.

Vallet, D., Kaneko, Y., Yashima, S., Gaudestad, J., (2014). Magnetic Current Imaging for Electrical Fault Isolation. In Proceedings of the 34th Annual NANO Testing Symposium  (NANOTS2014). Osaka: Institute of NANO Testing.

Gaudestad, J., Nuez, D., & Tan, P. (2014). Short Localization in 2.5D Microchip with Interposer using Magnetic Current Imaging. Proc. 40th ISTFA, 43-48.

Vallett, D., Gaudestad, J., & Richardson, C. (2014, November). High-Resolution Backside GMR Magnetic Current Imaging on a Contour-Milled Globally Ultrathin Die. In ISTFA proceedings (pp. 23-27).

Gaudestad, J., Orozco, A., De Wolf, I., Wang, T., Webers, T., Kelley, R., … & Madala, S. (2014, November). Failure analysis work flow for electrical shorts in triple stacked 3D TSV daisy chains. In Proc. of the 40th International Symposium for Testing and Failure Analysis (ISTFA) (pp. 38-42).

Orozco, A., Gagliolo, N. E., Rowlett, C., Wong, E., Moghe, A., Gaudestad, J., … & Dobritz, S. (2014, November). 3D IC/stacked device fault isolation using 3D magnetic field imaging. In Proc. of the 40th International symposium for Testing and Failure Analysis (ISTFA) (pp. 33-37).

Gaudestad, J., Orozco, A., Kimball, M., Gopinadhan, K., & Venkatesan, T. (2014, June). Short localization in a multi chip BGA package. In Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (pp. 74-77). IEEE.

Courjault, N., Infante, F., Bley, V., Lebey, T., & Perdu, P. (2014, June). Improvement of 3D current mapping by coupling magnetic microscopy and X-Ray computed tomography. In Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (pp. 26-29). IEEE.

Gaudestad, J., & Vallett, D. (2014, October). Magnetic Field Imaging for Non-Destructive 3D Package Fault Isolation. In International Symposium on Microelectronics (Vol. 2014, No. 1, pp. 000635-000640). International Microelectronics Assembly and Packaging Society.

Gaudestad J, Orozco A. Magnetic Field Imaging for non destructive 3D IC testing. Microelectron Reliab (2014),
http://dx.doi.org/10.1016/j.microrel.2014.07.080 

 

Jeffers, A., Cheng, B., Wellstood, F. C., Cawthorne, A. B., & Infante, F. (2013). 3D Magnetic Field Imaging for Non-destructive Fault Isolation. In ISTFA 2013: Proceedings from the 39th International Symposium for Testing and Failure Analysis (p. 189). ASM International.

Gaudestad, J. et al, (2014). 3D IC Analysis using Magnetic Field Imaging. In Proceedings of the 33rd Annual NANO Testing Symposium  (NANOTS2013). Osaka: Institute of NANO Testing.

Gaudestad, J., Talanov, V., Orozco, A., & Marchetti, M. (2013). Open Localization in Micro Lead Frame Package using Space Domain Reflectometry. In ISTFA 2013: Proceedings from the 39th International Symposium for Testing and Failure Analysis (p. 270). ASM International.

Qiu, W., Tan, S. C., Tay, M. Y., Gaudestad, J., Talanov, V. V., & Wei, M. S. (2013, July). Non-destructive open fault isolation in flip-chip devices with space-domain reflectometry. In Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (pp. 332-336). IEEE. doi: 10.1109/IPFA.2013.6599176

Gaudestad, J., Talanov, V. V., Orozco, A., & Khoo, K. L. (2013, April). Open localization on copper wirebond using Space Domain Reflectometry. In 2013 IEEE International Reliability Physics Symposium (IRPS) (pp. 5B-1). IEEE. doi: 10.1109/IRPS.2013.6532024

Chin, J. M., Narang, V., Tay, M. Y., Phoa, S. L., Venkat, R., Ei, L. H., … & Tan, J. (2013, July). Recent advances in fault isolation for semiconductor industry. In Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (pp. 269-279). IEEE. doi: 10.1109/IPFA.2013.6599166

Gaudestad, J., Gagliolo, N., Talanov, V. V., Yeh, R. H., & Ma, C. J. (2013, July). High resolution magnetic current imaging for die level short localization. In Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (pp. 347-350). IEEE. doi: 10.1109/IPFA.2013.6599179

Talanov, V. V., Lettsome Jr, N. M., Borzenets, V., Gagliolo, N., Cawthorne, A. B., & Orozco, A. (2013). A near-field scanning SQUID microwave microscope. arXiv preprint arXiv:1310.0078.

Gaudestad J et al. Opens localization on silicon level in a Chip Scale Package using space domain reflectometry. Micro-electron Reliab (2013), doi: 10.1016/j.microrel.2013.08.009

Gaudestad, J., Orozco, A., Talanov, V., & Huang, P. C. (2012, April). Open failure detection in 3D device non destructively. In Proceedings of the LSI Testing Symposium, Hyatt Maui, HI, USA (pp. 23-26).

Vallett, D. P., Bader, D. A., Talanov, V. V., Gaudestad, J., Gagliolo, N., & Orozco, A. (2012). Localization of dead open in solder bump by space domain reflectometry. In ISTFA 2012 proceedings (pp. 17-12).

Xie, M., Qian, Z., Pacheco, M., Wang, Z., Dias, R., & Talanov, V. (2012). Fault Isolation of Open Defects Using Space Domain Reflectometry. In ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis: November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA (p. 11). ASM International.

Schmidt, C., Altmann, F., & Vallett, D. P. (2012). Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D defect localization of System in Packages. In Proceedings of 38th International Symposium for Testing and Failure Analysis (pp. 88-94).

Gaudestad, J., Talanov, V., Gagliolo, N., & Orozco, A. (2012, July). Space Domain Reflectometry for open failure localization. In 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 1-5). IEEE. doi: 10.1109/IPFA.2012.6306311

Gaudestad, J., Talanov, V., & Huang, P. C. (2012). Space Domain Reflectometry for opens detection location in microbumps. Microelectronics Reliability, 52(9-10), 2123-2126. doi: 10.1016/j.microrel.2012.07.019

Gaudestad, J., Talanov, V. V., & Huang, P. C. (2012). Space domain reflectometry for opens detection in stacked-die packages. Electronic Device Failure Analysis, 14(3), 22-28.

Infante, F. (2012). Magnetic Microscopy to Reconstruct 3-D Currents in Complex Systems. Electronic Device Failure Analysis, 14(3), 12-20.

Vallett, D. P. (2011). A comparison of lock-in thermography and magnetic current imaging for localizing buried short-circuits. In ISTFA proceedings (pp. 146-152).

Infante, F., Perdu, P., & Lewis, D. (2010). Magnetic microscopy for ground plane current detection: a fast and reliable technique for current leakage localization by means of magnetic simulations. Microelectronics Reliability, 50(9-11), 1700-1705.

Infante, F., Perdu, P., Petremont, S., & Lewis, D. (2009, July). A new methodology for short circuit localization on integrated circuits using magnetic microscopy technique coupled with simulations. In 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 208-212). IEEE.

Infante, F., Perdu, P., & Lewis, D. (2009). Magnetic microscopy for 3D devices: Defect localization with high resolution and long working distance on complex system in package. Microelectronics Reliability, 49(9-11), 1169-1174. doi: 10.1016/j.microrel.2009.06.041

Orozco, A. (2009). Magnetic Current Imaging in Failure Analysis. Electronic Device Failure Analysis, 11(4), 14-21

 

Hylton, R. R. (2008, November). Techniques for identification of silver migration in plastic encapsulated devices assembled with molding compound containing red phosphorus flame retardant material. In Thirty-fourth International Symposium for Testing and Failure Analysis (p. 112). ASM International.

Nail C., Rocha J., and Wong L. (2008, November). A Procedure for Identifying the Failure Mechanism Responsible for A Pin-To-Pin
Short Within Plastic Mold Compound Integrated Circuit Packages. In Thirty-fourth International Symposium for Testing and Failure Analysis. ASM International.

Teo, C. W., Lwin, H. E., Narang, V., & Chin, J. M. (2008, July). Device-level fault isolation of advanced flip-chip devices using scanning SQUID microscopy. In 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 1-4). IEEE. doi: 10.1109/IPFA.2008.4588164

Hechtl, M. (2008, July). Backside GMR Magnetic Microscopy for flip chip and related microelectronic devices. In 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 1-4). IEEE. doi: 10.1109/IPFA.2008.4588181.

Felt, F., Knauss, L., Gilbertson, A., & Orozco, A. (2007, November). Construction of a 3-D current path using magnetic current imaging. In INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS (Vol. 33, p. 197). ASM International.

Hechtl, M., Steckert, G., & Keller, C. (2006, July). Localization of electrical shorts in dies and packages using magnetic microscopy and lock-in-IR thermography. In 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 252-255). IEEE. doi: 10.1109/IPFA.2006.251041

Woods, S. I., Orozco, A., & Knauss, L. A. (2006). Advances in Magnetic Current Imaging for Die-Level Fault Isolation. Electronic Device Failure Analysis, 8(4), 26.

Rogers, K. L., & Pecht, M. G. (2006). A variant of conductive filament formation failures in PWBs with 3 and 4 mil spacings. Circuit World. doi: 10.1108/03056120610663362

Felt, F. (2005, November). Analysis of a Microcircuit Failure using SQUID and MR Current Imaging. In International Symposium Physical & Failure Analysis of Integrated Circuits.

Nikawa, K., & Sakai, S. (2005, November). Newly-developed scanning laser-SQUID microscope. In Istfa 2005: Proceedings of the 31st International Symposium for Testing and Failure Analysis. ASM International.

Pacheco, M., Wang, Z., Skoglund, L., Liu, Y., Medina, A., Raman, A., … & Ramanathan, S. (2005). Advanced Fault Isolation and Failure Analysis Techniques for Future Package Technologies. Intel Technology Journal, 9(4).

Pacheco, M., & Wang, Z. (2004). Scanning SQUID microscopy for new package technologies. In ISTFA 2004: 30 th International Symposium for Testing and Failure Analysis (pp. 67-72).

Hillman, C. (2004). A Novel Approach to Identifying and Validating Electrical Leakage in Printed Circuit Boards through Magnetic Current Imaging. University of Maryland.

Crepel, O., Descamps, P., Poirier, P., Desplats, R., Perdu, P., & Firiti, A. (2004). Magnetic Current Imaging Techniques: Comparative Case Studies. In ISTFA 2004: 30 th International Symposium for Testing and Failure Analysis (pp. 29-32).

Hsiung, S., Tan, K. V., Komrowski, A. J., Sullivan, D. J. D., Gaudestad, J., Orozco, A., … & Knauss, L. A. (2004, April). Failure analysis on resistive opens with Scanning SQUID Microscopy. In 2004 IEEE International Reliability Physics Symposium. Proceedings (pp. 611-612). IEEE. doi: 10.1109/RELPHY.2004.1315414

Knauss, L. A., Orozco, A., & Woods, S. I. (2004, July). Advances in magnetic-based current imaging for high resistance defects and sub-micron resolution. In Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No. 04TH8743) (pp. 267-270). IEEE. doi: 10.1109/IPFA.2004.1345620

Crépel, O., Poirier, P., & Descamps, P. (2004, July). Magnetic microscopy for ICs failure analysis: comparative case studies using SQUID, GMR and MTJ systems. In Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No. 04TH8743) (pp. 45-48). IEEE. doi: 10.1109/IPFA.2004.1345534

Knauss, L. A., Woods, S. I., & Orozco, A. (2004). Current imaging using magnetic field sensors. Microelectronics Failure Analysis Desk Reference, 5, 303-311.

Takeuchi, I., Famodu, O. O., Read, J. C., Aronova, M. A., Chang, K. S., Craciunescu, C., … & Orozco, A. (2003). Identification of novel compositions of ferromagnetic shape-memory alloys using composition spreads. Nature materials, 2(3), 180-184. doi: 10.1038/nmat829

Knauss, L. A., Orozco, A., Woods, S. I., & Cawthorne, A. B. (2003). Advances in scanning SQUID microscopy for die-level and package-level fault isolation. Microelectronics Reliability, 43(9-11), 1657-1662. doi: 10.1016/S0026-2714(03)00296-8

Orozco, A., Talanova, E., Gilbertson, A., Knauss, L. A., Wang, Z., Skoglund, L., … & Dias, R. (2003, November). Fault isolation of high resistance defects using comparative magnetic field imaging. In INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS (pp. 9-13). ASM International. 

Woods, S., Lettsome, N. M., Cawthorne, A. B., Knauss, L. A., & Koch, R. H. (2003, November). High resolution current imaging by direct magnetic field sensing. In INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS (pp. 6-8). ASM International.

Knauss, L. A., Orozco, A., Woods, S. I., & Cawthorne, A. B. (2003). Advances in scanning SQUID microscopy for die-level and package-level fault isolation. Microelectronics Reliability, 43(9-11), 1657-1662. doi: 10.1016/S0026-2714(03)00296-8

Vallett, D. P. (2002). Scanning SQUID Microscopy for die level fault isolation. In ISTFA 2002: 28 th International Symposium for Testing and Failure Analysis (pp. 391-396).

Knauss, L. A., Cawthorne, A. B., Lettsome, N., Kelly, S., Chatraphorn, S., Fleet, E. F., … & Vanderlinde, W. E. (2001). Scanning SQUID microscopy for current imaging. Microelectronics Reliability, 41(8), 1211-1229.

Dias, R., Skoglund, L., Wang, Z., & Smith, D. (2001). Integration of SQUID microscopy into FA flow. In INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS (pp. 77-82). ASM International; 1998.

Wills, K. S., de Leon, O. D., Ramanujachar, K., & Todd, C. P. (2001). Super-Conducting Quantum Interference Device Technique: 3-D Localization of a Short within a Flip Chip Assembly. In INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS (pp. 69-76). ASM International; 1998.

Mai, Z. H., Palaniappan, M., Chin, J. M., Soh, C. E., Knauss, L. A., & Fleet, E. F. (2001, July). Short failure analysis under fault isolation. In Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No. 01TH8548) (pp. 202-205). IEEE.

Knauss, L. A., Frazier, B. M., Cawthorne, A. B., Budiarto, E., Crandall, R., Melnik, S., & Bennett, C. (2000). Backside fault isolation using a magnetic field imaging system on SRAMs with indirect shorts. In INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS (pp. 503-510). ASM International; 1998.

Vanderlinde, W. E., Cheney, M. E., McDaniel, E. B., Skinner, K. L., Knauss, L. A., Frazier, B. M., & Christen, H. M. (2000, April). Localizing power to ground shorts in a chips-first MCM by scanning SQUID microscopy. In 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No. 00CH37059) (pp. 413-419). IEEE. 

Chatraphorn, S., Fleet, E. F., Wellstood, F. C., Knauss, L. A., & Eiles, T. M. (2000). Scanning SQUID microscopy of integrated circuits. Applied physics letters, 76(16), 2304-2306. doi: 10.1063/1.126327

Knauss, L. (1999). Detecting power shorts from front and backside of IC packages using scanning SQUID microscopy. In ISTFA 1999: 25 th International Symposium for Testing and Failure Analysis (pp. 11-16).